Performance Advantages
● Microporous ceramic bond enables efficient grinding
● Finely screened abrasive particle size to achieve low damage and good surface quality
● Various particle sizes and binders are available to meet the processing requirements of different materials and products with different precision
●Fast response speed, rapid iteration of new material grinding solutions
Product Parameters
Application Scenario
Thinning and grinding of silicon wafers, SIC wafers, gallium nitride , lithium niobate and other materials .
Grinding Case
| Grinding workpiece | SIC substrate |
| Workpiece size | 6 inches |
| Grinding wheel size | D313(12 inches) V 8000# |
| Grinding wheel speed | 2803 |
| Table speed | 221 |
| Feed rate | 0.6/0.4/0.3 |
| Wear ratio | 1:1 |
| Roughness | Periphery 1.5 Center 1.0 |
| ttv | ≤3μ |